JunPus High Thermal Pad P600 - 100 x 100 x 1.5mm
JP-P600 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. JPP600 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
JP-P600 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JPP600 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly.
JP-P600 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.
Applications:
- Electronic components: IC, CPU, MOS, LED, M/B, P/S, HEAT SINK, LCD-TV, N/B PC, PC, Telecom Device, Wireless Hub etc.
- DDR II Module, DVD Applications, Hand-set applications etc
- Very good insulator
- Easy to assembly
- Good thermal conductivity
- Ultra soft and high compressibility
- Natural tack
| Test item | Test method | Unit | Test value | |
| JP-P600 value | JP-P520 value | |||
| Color | Visual | blue/red | yellow/blue | |
| Thickness | ASTM D374 | Mm | 0.25~5.0 | 0.25~5.0 |
| Density | ASTM D792 | g/cc | 2.8 | 2.8 |
| Hardness | ASTM D2240 | Shore C | 30±5 | 30±5 |
| Tensile Strength | ASTMD412 | KN/m | 0.4 | 0.4 |
| Continuous use Temp | EN344 | ℃ | -40~+220 | -40~+220 |
| Volume Resistivity | ASTM D257 | Ω-cm | 2.2×1011 | 3.2×1011 |
| Voltage Endu Ance | ASTM D149 | KV/mm | >5.0 | >5.0 |
| Thermal impedance | ASTM-D5470 | ℃in2/W | 0.2 | 0.3 |
| Flame Rating | UL-94 | V-0 | V-0 | |
| Conductivity | ASTM-D5470 | w/m-k | 6.0 | 5.2 |
Thickness:1.0mm
Dimension:100mm x 100mm
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